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searching for Wire bonding 12 found (61 total)

Thermosonic bonding (1,056 words) [view diff] exact match in snippet view article find links to article

world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing

Beam lead technology (355 words) [view diff] no match in snippet view article find links to article

integrated circuits. This technology eliminated the labor-intensive wire-bonding process that was commonly used for integrated circuits at the time. It

IEEE Rao R. Tummala Electronics Packaging Award (213 words) [view diff] case mismatch in snippet view article find links to article

award for 2010, ElectroIQ, June 10, 2010. Harman Receives IEEE Award for Wire Bonding Improvements, ElectroIQ, May 13, 2009. C. P. Wong, Regent's Professor

Kilogram-force (796 words) [view diff] case mismatch in snippet view article find links to article

high as 230 Kilograms force. Author=Park Tool Harman, George G. (2010). Wire Bonding in Microelectronics (3rd ed.). New York: McGraw-Hill. p. 408. ISBN 978-0-07-164265-1

Narec (2,817 words) [view diff] exact match in snippet view article find links to article

LGBC Silicon Solar Cell with modified bus bar suitable for high volume wire bonding Process and device modelling for enhancement of silicon solar cell efficiency

Mullard Space Science Laboratory (1,299 words) [view diff] exact match in snippet view article find links to article

a cleanroom facility, Laser and Sputter coating facility, a Westbond wire bonding facility, ultrasonic cleaning facilities, and a mechanical engineering

Jason Chang (316 words) [view diff] case mismatch in snippet view article find links to article

Chang Receives SEMI Award for Achievements in the Advancement of Copper Wire Bonding Technology". MarketWatch. 4 September 2015. Archived from the original

Zirconia toughened alumina (518 words) [view diff] exact match in snippet view article find links to article

Alumina, including valve seals, bushing, pump components, joint implants, wire bonding capillaries, cutting tool inserts, and many more. ZTA has a diverse range

Pentium Pro (4,197 words) [view diff] exact match in snippet view article find links to article

heat sink. The dies are connected to the package using conventional wire bonding. The cavities are capped with a ceramic plate. The Pentium Pro with 1 MB

Scanning joule expansion microscopy (2,699 words) [view diff] no match in snippet view article find links to article

degrade or compromise the integrity of the sample. For micro/nano devices, wire-bonding is usually necessary to apply voltage, further increasing processing

Restriction of Hazardous Substances Directive (7,748 words) [view diff] exact match in snippet view article find links to article

shock, solder paste printability, contact resistance, and aluminium wire bonding performance and nearing their performance in other attributes. The properties

Scanning SQUID microscopy (5,448 words) [view diff] exact match in snippet view article find links to article

very well in advanced wire-bond packages. Because of the high density wire bonding in advanced wire-bond packages, it is extremely hard to localize the